Job Description

Description

This position is for Staff Packaging Engineer in Skyworks Irvine location. Your primary responsibility is to work on developing thermal and mechanical models for IC packaging. You will be working as part of the Advanced IC Packaging team that enables new packaging technology as well as sustain existing packaging technology for wireless applications. You will be a key team player working with several cross-functional teams and customers. Working and living in Irvine provides a wonderful lifestyle in a vibrant coastal city consistently ranked as one of the country’s safest cities!

Responsibilities

• Develop IC package level mechanical Finite Element Models to characterize internal stress/strain in packages due to various package assembly related processes in order to ensure high yield.
• Develop mechanical models to characterize the stress/strain and useful lifetime of the packages under highly accelerated reliability testing conditions.
• Develop thermal models to characterize the package thermal resistance parameters such as Theta j-a, Theta j-c, Theta j-b, Psi j-t etc.
• Document all simulation models, codes and scripts and present the results to broader team.
• Work with material suppliers and with material testing labs to characterize relevant material properties as needed for modeling.
  

Required Experience and Skills

• Mechanical Engineering degree required – B.S. with 8+ years experience, M.S. with 6+ years experience or Ph.D. with 3+ years experience is preferred.
• In-depth knowledge of solid mechanics, heat transfer and materials science.
• Experience using Finite Element Analysis tools such as ANSYS (APDL & Workbench), ICEPAK, ABAQUS, FLOTHERM, COMSOL or other similar tools.
• Experience with IC packaging modeling & simulation with exposure to packaging failure analysis.
• Experience in simulating IC packaging assembly steps such as die attach, wire-bonding, over-molding, materials curing and reliability testing conditions such as drop/shock, thermal cycling, cyclic bend etc.
• Experience in simulation and characterization of IC packaging thermal resistance parameters as defined in JEDEC standards.
• Good understanding of various electronic packaging technologies (SiP, MCM, WLCSP, Dual-sided packages etc.), structures and processes.
• Any experience with materials testing/characterization and thermal testing is a plus.
• Must have excellent verbal and written communication skills and presentation skills.
• Well versed in use of Microsoft Office tools.

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The typical base pay range for this role across the U.S. is currently USD $112,500 - $215,900 per year . Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance. 

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [email protected].

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